Configurable single substrate wet-dry integrated cluster cleaner

ABSTRACT

The present invention provides a method and an apparatus for cleaning substrates. The cleaning chamber defines a processing cavity adapted to accommodate a substrate therein. In one embodiment, the cleaning chamber includes an upper plate, a lower plate and a gas manifold disposed there between. A substrate is disposed in the processing cavity without contacting other chamber components by a Bernoulli effect and/or by a fluid cushion above and/or below the substrate. Fluid is flowed into the processing cavity at an angle relative to a radial line of the substrate to induce rotation of the substrate during a cleaning and drying process. A cleaning process involves flowing one or more fluids onto a surface of the substrate during its rotation. One-sided and two-sided cleaning and drying is provided.

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims benefit of U.S. provisional patentapplication serial No. 60/212,127, filed Jun. 16, 2000, which is herebyincorporated by reference.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to semiconductor processing, andmore particularly, to a substrate cleaning apparatus and method.

[0004] 2. Background of the Related Art

[0005] The manufacture of semiconductor components includes manyprocesses and steps. Typical processes include chemical vapordeposition, physical vapor deposition, etching, ion implementation,epitaxial growth, and the like. During one or more of the processesperformed in the manufacture of semiconductor devices, the substrate onwhich the devices are disposed must be cleaned. Cleaning is generallynecessary to remove residue which may have accumulated on the devices inprevious manufacture steps, which may damage the devices.

[0006] One conventional cleaning method involves dipping a substrate, ormore commonly a rack of substrates, in an aqueous solution to removeresidue from the surface of the substrate. The cleaning solutions areoften contained in tanks open to the atmosphere. As a result, airborneparticles can enter into the process solutions. Through surface tension,these particles are easily transferred to the substrate surfaces as thesubstrates are dipped and lifted out of the tanks.

[0007] Another example of a conventional technique is known as a cascaderinse. A cascade rinse utilizes a cascade rinser, which includes innerand outer chambers separated by a partition. Rinse water flows from awater source into the inner chamber and then to the outer chamber. Asubstrate is cleaned by passing the substrate through the rinse water ofthe inner chamber. This process is often used to neutralize and removeacid from an etched substrate.

[0008] One problem with the cascade rinser is that “dirty water” oftenexists in the inner chamber. The dirty water typically includes residualacid as well as particles that often attach to the substrate. Theseparticles can cause defects in the devices of the substrate, therebyreducing the number of usable dyes on a typical substrate.

[0009] Subsequent to a fluid cleaning process, the substrates generallymust be dried. Thus, in addition to being ineffective cleaning methods,the foregoing cleaning techniques also suffer from the fact that thesubstrate must generally be moved to another location to undergo thedrying process. Transferring substrates between environments isundesirable, as the potential for contamination increases with eachtransfer.

[0010] As a result of the shortcomings of the processes described above,techniques have been developed to both rinse and dry substrates at onelocation. One such technique, known as spin-rinse-dry, uses acombination of rinse water to rinse the substrate and high speedrotation to remove the cleaning fluid from the substrate. During therotation of the substrate, one or more fluids are delivered on thesubstrate's surface and allowed to flow outwardly over the substrate asa result of the rotation. The fluids may include chemicals such as adissolving fluid to react with material in the substrate and water toflush the dissolved material from the substrate's surface. Drying thesubstrate is accomplished by continuing to rotate the substrate afterterminating the fluid flow. The fluid is removed from the substrateduring the dry step as a result of the centrifugal force exerted on thefluid as a result of the rotation and the evaporation of the fluid.

[0011] One problem with spin-rinse-dry techniques is the generation ofparticles during the process cycle. The particles are generated becauseof the need to chuck the substrate against a support member. Typically,a substrate is positioned on the support member and then chucked theretoby applying a backside pressure. Additionally or alternatively, clampingmembers disposed at a perimeter portion of the substrate may provide asufficient force to secure the substrate during the process cycle. Inany case, contact between the substrate and mechanical components suchas the support member and/or clamping mechanisms, often generateparticulates which can contaminate the devices.

[0012] As the feature sizes of integrated circuits become smaller, theproblems associated with particulates worsen. As a result, currentmethods and apparatus are not well suited for the next generation ofintegrated circuits.

[0013] Therefore, there is a need for an apparatus and method to cleanand dry a substrate.

SUMMARY OF THE INVENTION

[0014] The invention provides a method and apparatus for cleaning and/ordrying a substrate. In a first aspect of the invention, a substratecleaning chamber is provided comprising a chamber body defining aprocessing cavity adapted to accommodate a substrate, inlets formed inthe chamber body and in fluid communication with the processing cavity,and evacuation ports disposed about the processing cavity at a radialdistance from a center axis of the processing cavity.

[0015] In another aspect of the invention, the substrate cleaningchamber further comprises a plurality of propulsion channels terminatingon upper and lower surfaces of the processing cavity. A fluid deliverysystem may be coupled to the fluid inlets and to the plurality ofpropulsion channels.

[0016] In yet another aspect of the invention, a processing systemcomprises a transfer chamber at least one substrate cleaning chamber. Inone embodiment the substrate cleaning chamber comprises a chamber bodydefining a processing cavity adapted to accommodate a substrate andfurther defining an opening to accommodate transfer of a substrate fromthe transfer chamber into the processing cavity. At least one fluidinlet is formed in the chamber body and in fluid communication with theprocessing cavity. One or more gas ejection ports are disposed about theprocessing cavity at a radial distance from a center axis of theprocessing cavity and oriented at an angle relative to a radial lineoriginating at the center axis.

[0017] In still another aspect of the invention, a method for cleaning asubstrate is provided, the method comprising providing a chamber bodyhaving a cavity at least partially defined by an upper surface and lowersurface, positioning a substrate in the cavity, flowing a first fluidinto the cavity and onto the substrate, and flowing a second fluid ontothe substrate at an angle to cause rotation of the substrate about acenter axis.

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] So that the manner in which the above recited features,advantages and objects of the present invention are attained and can beunderstood in detail, a more particular description of the invention,briefly summarized above, may be had by reference to the embodimentsthereof which are illustrated in the appended drawings.

[0019] It is to be noted, however, that the appended drawings illustrateonly typical embodiments of this invention and are therefore not to beconsidered limiting of its scope, for the invention may admit to otherequally effective embodiments.

[0020]FIG. 1 is a cross section of a cleaning chamber showing an upperplate and a lower plate in a substrate loading/unloading position.

[0021]FIG. 2 is a cross section of a cleaning chamber showing an upperplate and lower plate in substrate processing position.

[0022]FIG. 3 is a partial cross sectional view of a cleaning chamberincluding a manifold.

[0023]FIG. 4 is a top view of a manifold.

[0024]FIG. 5 is a cross section of a cleaning chamber during loading orunloading of a substrate.

[0025]FIG. 6 is a cross section of a cleaning chamber in a processingposition.

[0026]FIG. 7 is a partial cross section view of a cleaning chambershowing flow patterns of fluid.

[0027]FIG. 8 is a cross section of a cleaning chamber during loading orunloading of a substrate.

[0028]FIG. 9 is a cross section of a cleaning chamber having a substratedisposed therein for processing.

[0029]FIG. 10 is a partial sectional view of a chamber illustrating theflow patterns of fluid through inlets and in a processing cavity.

[0030]FIG. 11 is an alternative embodiment of a processing system.

[0031]FIG. 12 is an alternative embodiment of a manifold.

[0032]FIG. 13 is a flow diagram illustrating a one-sided and two-sidedcleaning process.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0033] The invention generally provides an apparatus and method forcleaning and drying the substrate. In one aspect, a processing systemincludes a loading station, a transfer chamber and at least one cleaningstation accessible from the transfer chamber. One or more robotsdisposed in or near the processing system facilitate transfer of thesubstrates therethrough.

[0034] In one embodiment, a cleaning chamber includes an upper plate anda lower plate which define a processing cavity. Primary fluid deliverychannels are formed in a central portion of the upper plate and lowerplate and terminate at lower and upper surfaces of the plates,respectively. Auxiliary fluid delivery channels extend angularly outwardfrom the central portion of the plates to the lower and upper surfaces.The auxiliary fluid delivery channels, which may be termed propulsionchannels, are coupled to deflection recesses formed in the lower andupper surfaces of the upper and lower plates, respectively. A fluidsupply unit is coupled to the primary and auxiliary fluid deliverychannels. In operation, fluids are delivered from the fluid supply unitto the processing cavity via the primary and auxiliary fluid deliverychannels. Fluid is flowed from the auxiliary fluid delivery channels tothe deflection recesses to provide an angular fluid flow pattern at thesurface of a substrate being processed, thereby causing the substrate torotate. In one embodiment, a drying agent is flowed through the primaryand auxiliary fluid delivery channels to dry the substrate after acleaning process.

[0035] In one embodiment, an annular exhaust manifold is mounted to theupper plate. The manifold includes ports which are fluidly coupled to anexhaust system including a pump. The ports are oriented at an anglerelative to a radial line originating at a center axis of the cavity.Accordingly, fluid being drawn into the ports provides an angular flowpattern proximate to the substrate, thereby rotating the substrate.

[0036]FIG. 1 shows a schematic diagram of a processing system 100. Theprocessing system 100 generally includes a cleaning chamber 102, a fluidsupply unit 103 and an exhaust system 105. The cleaning chamber 102includes a lower plate 110 and an upper plate 112 defining processingcavity 114 therebetween. A supply line 107, having a pair of inlet lines120 a-b coupled to the cleaning chamber 102, is connected at one end tothe fluid supply unit 103, thereby allowing fluid flow from the fluiddelivery unit 103 to the cleaning chamber 102. In one embodiment, afirst inlet line 120 a is coupled to the upper plate 112 while a secondinlet line 120 b is coupled to the lower plate 110.

[0037] The fluid supply unit 103 includes a drying fluid module 104 anda plurality of cleaning fluid modules 106 a-d. The drying fluid module104 preferably includes at least one container 121 containing a carriergas, such as N₂, and a drying agent such as isopropyl alcohol (IPA).Fluid flow from the drying fluid module to the cleaning chamber 102 iscontrolled by a valve 126 disposed in a fluid delivery line 128 which isconnected to the supply line 107.

[0038] The cleaning fluids in the cleaning fluid modules 106 a-d areselected according to particular processes. In the embodiment shown inFIG. 1, each of the cleaning fluid modules 106 a-d includes at least onecontainer 122-125 that supplies a fluid or mixture of fluids to thecleaning chamber 102. In one embodiment, the first cleaning fluid module106 a contains fluids used during post silicon etch processes, thesecond module 106 b contains fluids used during post metal and oxideetch processes, the third module 106 c contains fluids used during postimplant processes and the fourth module 106 d contains fluids usedduring pre-thermal processes. Illustrative fluids of the first module106 a include a combination of H₂SO₄, O₃ and deionized (DI) water in afirst container 122 a, DHF in a second container 122 b and DI in a thirdcontainer 122 c. Illustrative fluids of the second module 106 b includeECK 600 in a first container 123 a, EKC 4000 in a second container 123 band DI in a third container 123 c. Illustrative fluids of the thirdmodule 106 c include a combination of H₂SO₄, O₃ and deionized (DI) waterin a first container 124 a and DI in a second container 124 b.Illustrative fluids of the fourth module 106 d include a combination ofH₂SO₄ and H₂O₂ in a first container 125 a, a combination of NH₄OH, H₂O₂and DI in a second container 125 b, HCL, H₂O₂ and DI in a thirdcontainer 125 c, DHF in a fourth container 125 d, hot DI in a fifthcontainer 125 e and DI in a sixth container 125 f.

[0039] Fluid flow from the individual containers 122-125 into a fluiddelivery line 132 is controlled by valves 130 a-d. Additionally, theflow of fluids from the fluid delivery line 132 into the inlet lines 120a-b is controlled by a valve 134.

[0040] Fluid flow from the cleaning chamber 102 is achieved by employingthe exhaust system 105. The exhaust system 105 is coupled to thecleaning chamber 102 by one or more exhaust lines 139. The exhaustsystem preferably includes one or more pumps and valves adapted toprovide a pressure gradient between the chamber 102 and the exhaustsystem 105.

[0041] In one embodiment, the processing system 100 includes a chemicalreturn module 140. The chemical return module 140 is adapted to collectfluids expelled from the cleaning chamber 102 and process them accordingto the fluid type. Illustratively, the chemical return module 140 mayinclude an IPA recycle unit, a waste treatment unit, a DI reclaim unitand a solvent reclaim unit. Such an embodiment economizes the cost ofoperation of the processing system 100.

[0042]FIG. 2 shows a cross section of a cleaning chamber 102. Thechamber 102 typically includes an upper plate 112, a lower plate 110 anda manifold 213. In one embodiment, the upper plate 112 and lower plate110 are each made of a material selected to minimize the potential forparticle generation. Illustratively, the plates 110, 112 may bemanufactured of Teflon. Although shown in FIG. 2 as substantiallymonolithic, i.e., being formed of a single piece of material, the plates110, 112 may be formed of any number of components.

[0043] The lower plate 110 is disposed on a base 216 and secured theretoby fasteners 218. Fasteners 218 may be any mechanism adapted to rigidlysecure the lower plate 110 to the base 216. In the embodiment of FIG. 2,the fasteners 218 are a combination of bolts and nuts. The lower plate110 is a generally annular member having a lower surface 222circumscribed by a lip 230. The lower surface 222 is a substantiallyplaner surface that may be highly polished in order to minimize theturbulence of gas flowing over the lower surface 222. A seal 232, suchas an elastomeric member, is disposed outwardly of the lip 230. Duringoperation, the seal 232 is preferably disposed against a surface of themanifold 213 in the manner described below to seal the processing cavity114 (shown in FIG. 1).

[0044] A lower primary fluid delivery channel 220 (hereinafter referredto as the “lower primary channel 220”) is formed in the lower plate 110.The lower primary channel 220 extends vertically through the lower plate110 and terminates at a lower surface 222. One end of the lower primarychannel 220 is diametrically enlarged to accommodate coupling 224. Thecoupling 224 provides a connection mechanism for the inlet line 120 b.Accordingly, fluid can be supplied from the fluid supply unit 103 to thelower surface 222.

[0045] Auxiliary fluid delivery channels 225 (hereinafter referred to asthe “auxiliary channels 225”) extend through the lower plate 110 fromthe coupling 224 to the lower surface 222. The auxiliary channels 225are angled to extend radially outwardly from the coupling 224 by somedegree. Accordingly, the auxiliary channels are separated from the lowerprimary channel 220 by an increasing radius as the auxiliary channels225 near the lower surface 222.

[0046] The upper plate 112 is shown disposed above the lower plate andsubstantially parallel therewith. The upper plate 112 is stabilized by abracket 256 and a shaft 258. The bracket 256 may be secured to the upperplate 112 by fastener 250 and to the shaft 258 by fastener 260. Theshafts 258 are connected to actuators 262 which are secured to the base216. The actuators 262 may be any device adapted to move the shafts 258along a vertical axis. Accordingly, the actuators 262 and shafts 258ensure that the plates 110, 112 are fixedly ridged along a horizontalaxis (X) while providing relative movement between the plates 110, 112along the vertical axis (Y).

[0047] In one embodiment the cleaning chamber 102 is substantiallysymmetrical so that the upper plate 112 is constructed similarly to thelower plate 110. Accordingly, the upper plate 112 is a generally annularmember having an upper primary fluid delivery channel 238 (hereinafterupper primary channel 238) formed at a central portion of the upperplate 112. One end of the upper primary channel 238 is diametricallyenlarged to accommodate a coupler 240 while another end of the upperprimary channel 238 terminates at an upper surface 236 of the upperplate 112. The coupler 240 provides an attachment mechanism for theinlet line 120 a, thereby connecting the fluid supply unit 103 with theupper plate 112.

[0048] Upper auxiliary fluid delivery channels 241 (hereinafter alsoreferred to as “upper auxiliary channels 241”) are formed in the upperplate 112 and extend toward the upper surface 236. Additionally, upperauxiliary channels 241 are oriented to extend radially outwardly by somedegree relative to the upper primary channel 238 in a manner similar tothe lower auxiliary channels 225 relative to the lower primary channel220.

[0049] As with the lower surface 222, the upper surface 236 ispreferably a highly polished surface to ensure substantially laminarflow of a fluid over the surface 236. The upper surface 236 is delimitedby an annular lip 246 disposed at a diameter substantially equal to thelip 230 of the lower plate 110.

[0050] In one embodiment, the plates 110, 112 are substantiallysymmetric and may be described with reference to FIGS. 3A-B. FIGS. 3A-Bshow a plan view of plates 110, 112 respectively illustrating theprimary channels 220, 238 and the auxiliary channels 225, 241. Theprimary channels 220, 238 is centrally disposed in the plates 110, 112respectively while the auxiliary channels 225, 241 extend radiallyoutwardly therefrom. Although six auxiliary channels 225, 241 are shownin FIGS. 3A-B, it is understood that any number of channels iscontemplated.

[0051] At an outlet ends 302, 304 proximate the surfaces 222, 236, theauxiliary channels 225, 241 bend sharply. One embodiment of theauxiliary channel 225 and the outlet end 302 taken along section lines4-4 of FIG. 3A, is shown in FIG. 4. The outlet end 302 has a slightupward inclination and couples to a deflection recess 402 formed in thelower surface 222. The deflection recess 402 is tapered upwardly so thatthe portion nearest the outlet end 302, 304 is relatively deeper thanthe terminal end of the deflection recess 402. In one embodiment, theoutlet end 302, 304 and the deflection recess 402 are oriented atbetween about 20 degrees and about 160 degrees relative to a radial line306 (shown in FIG. 3) originating at a center of the plate 110, 112. Theoutlet end 304 and a deflection recess 308 of the upper plate 112 may besimilarly constructed. However, while the outlet end 302 and deflectionrecesses 402 of the plate 110 have a clockwise orientation, outlet end304 and deflection recess 308 have a counter clockwise orientation whenviewed from above. Thus, when the plates 110, 112 are in facingrelationship, the outlet ends 302, 304 and the deflection recesses 402,308 are angled in the same direction.

[0052] Returning again to FIG. 2, the manifold 213 is shown coupled at alower outer portion of the upper plate 112 by the fasteners 250. Thefasteners 250 can be any mechanism adapted to facilitate easy removal ofthe manifold 213. Illustratively, the fasteners 250 are a combination ofnuts and bolts. Although preferably a separate component, in anotherembodiment the manifold 213 is an integral feature of the upper plate112. The manifold 213 is generally an annular member having a lowerportion 252 extending below the upper surface 236. In combination, thelower portion 252 and the upper surface 236 define a pocket 253 sized toaccommodate a substrate.

[0053]FIG. 2 shows the lower plate 110 in a raised/loading position. Insuch a position, the plates 110, 112 are separated by a space sufficientto allow a robot blade (not shown) to position a substrate between theplates 110, 112. FIG. 5 shows a cross section of the cleaning chamber102 wherein the upper plate 112 is in a lowered processing position. Insuch a position, a cavity 114 is formed between the upper plate 112 andthe lower plate 110. The cavity 114 is generally a disk-shaped gapdefined by the upper surface 236, the lower surface 222 and the lowerportion 252 of the manifold 213.

[0054]FIG. 6 shows a detailed view of FIG. 5 taken along the sectionlines 6-6. A lower surface 602 of the manifold 213 is disposed on aledge 604 of the lower plate 110. The seal 232 is disposed in adove-tail groove 606 and is sufficiently compressed by the lower surface602 to form an annular fluid-tight seal. A second seal 608 is disposedin a grove 610 formed in the manifold 213. Cooperatively, the seals 232and 608 ensure the fluid-tight integrity of the cavity 114.

[0055] An exhaust port 612 is disposed in the manifold 213 and includesa recess 614 formed at an inner diameter of the manifold 213. The recess614 is formed in the lower portion 252 of the manifold 213 at a heightsubstantially equal to the cavity 114 to allow fluid communicationtherewith. The port is fluidly coupled to the exhaust line 139 viaconnecting members such as tubes (described with reference to FIG. 7below). During processing, a substrate 616 is disposed in the cavity, aswill be described in more detail below.

[0056] One embodiment of the manifold 213 and the exhaust ports 612 isshown in FIG. 7 which is taken along the section lines 7-7 of FIG. 2.The manifold 213 is shaped as a ring having an inner diameter D1 and anouter diameter D2 and defines a central opening 701. A plurality ofequally spaced ports 612 include an inlet end 702 and outlet end 704. Inone embodiment, the inlet end 702 terminates at the recess 614 formed atthe inner diameter D1 of the manifold 213. The outlet end 704 ispreferably a quick-disconnect connector having a tube 710 coupledthereto. The tubes 710, in turn, are connected to the exhaust line 139shown in FIGS. 1, 2 and 6.

[0057] The orientation of the ports 612 is selected to provide atangential gas flow from the cavity 114 during processing. Accordingly,the ports 612 are oriented at an angle relative to a radial line 706originating at a center 708. As will be described in more detail below,gas flowed from the recesses 614 and into the ports 612 provides arotating flow pattern in the cavity 114.

[0058] The operation of the cleaning chamber 102 may be understood withreference to FIGS. 8 through 10. Referring first to FIG. 8, the cleaningchamber 102 is shown in a loading position. Specifically, the upperplate 112 has been actuated by actuators 262 to separate the upper plate112 from the lower plate 110. Plates 110, 112 are separated by distancesufficient to allow a robot blade carrying a substrate 616 to positionbetween the plates 110, 112. The substrate 616 is brought into closeproximity with the upper surface 236 and within the pocket 253 definedby the lower portion 252 of the manifold 213 and the upper surface 236.Gas is then flowed from the fluid supply unit 103 through the coupler240 and along the upper primary channel 238 and upper auxiliary channels241. The gas travels in the space between the upper surface 236 and thesubstrate 616 and creates a low pressure region sufficient to lift thesubstrate 616 from the blade. In addition to creating a low pressurearea, the gas flowing in the space between the substrate 616 and theupper surface 236 prevents the substrate from contact the upper surface236. The resulting Bernoulli effect provides a mechanism for chucking asubstrate without substantial contact between the substrate and othercomponents of the cleaning chamber 102.

[0059] During the chucking process just described, it may be desirableto align the substrate 616 into the space between the lower portion 252of the manifold 213. Accordingly, a tapered surface 802 may be providedat the inner diameter of the lower portion 252. As the substrate 616 islifted into the pocket 253, the edge of the substrate 616 may contactthe tapered surface 802. As the substrate 616 continues to move upwardlytoward the upper surface 236, the substrate 616 is urged into an alignedposition relative to the pocket 253 of the upper plate 112.

[0060] Once the substrate 616 is chucked to the upper plate 112, theactuators 262 lower the upper plate 112 into the position shown in FIG.9. Thus, the bottom surface 602 of the manifold 213 is seated on theledge 604 and is in abutment with the seal 606.

[0061] At some time prior to sealing the cleaning chamber 102, theexhaust unit 105 is activated. The exhaust unit 105 provides a negativepressure to exhaust the processing cavity 114 via the ports 612 of themanifold 213. Once the substrate is enclosed within the processingcavity 114 of the cleaning chamber 102 in the manner shown in FIG. 9,the substrate 616 may be processed according to various recipes andmethods. During a cleaning step, one or more fluids are flowed from oneor more of the modules 106 a-d of the fluid supply unit 103 to theprocessing cavity 114 via one or both of the plates 110, 112. As willdescribed below with reference to FIG. 13, the invention contemplatesprocessing one side or both sides of a substrate. In either case, thesubstrate is maintained in a spaced relationship with the surfacesdefining the processing cavity 114. Accordingly, the processing cavity114 provides a substantially contactless processing environment for thesubstrate.

[0062]FIG. 10 is a partial cross sectional view of the cleaning chamber102 and illustrates the flow pattern (shown by arrows) of fluid over thesubstrate 616. The location of the primary channels 220, 238 allows thefluids to be delivered to a central portion 1004 of the substrate 616.Thus, fluid is flowed substantially uniformly over an upper surface 1006and a lower surface 1008 of the substrate 616. As a result of fluid flowfrom the deflection recesses 402, the substrate 616 is caused to rotate.Specifically, the angled orientation of the outlet ends 302 and thedeflection recesses 402 provide a substantial tangential velocitycomponent to the fluid relative to the substrate surface. The frictionbetween the fluid and the substrate 616 causes the momentum of the fluidto be transferred to the substrate 616. As a result, a torque is exertedon the substrate 616 causing rotation about a central axis A of thecleaning chamber 102. In general, the rotational velocity of thesubstrate 616 may be controlled by adjusting the flow rate of the fluidsfrom the deflection recesses 402. In one embodiment, the substrate 616is rotated at between about 2000 rpm and about 3000 rmp.

[0063] The substrate rotation is further controlled by fluid flow intothe ports 612 of the manifold 213. Referring briefly to FIG. 7, thedirection of fluid flow proximate the ports 612 is shown by arrows 712.Fluid flow into the ports 612 induces a tangential flow pattern in theprocessing cavity 114 at the edge of the substrate 616. Accordingly, thevelocity of fluid flowing into the ports 612 may also be adjusted tocontrol rotation of the substrate 616.

[0064] Rotation of the substrate 616, achieves a washing action wherebyfluid flow is provided over all surfaces of the substrate 616 withminimal potential for “dead” areas where fluid flow is stagnant. As thefluid continues to flow over the surface of the substrate 616,particulate is flushed therefrom. The fluid carries the particulateoutwardly toward and over the edge of the substrate. The fluid is thenexpelled from the process cavity 114 through the ports 612.

[0065] Following a cleaning cycle, the substrate 616 may be dried byflowing a drying agent from the drying fluid module 104 of the fluidsupply unit 103 through the primary channels 220, 238 and the auxiliarychannels 225, 241. Illustrative cleaning and drying processes will bedescribed below with reference to FIG. 13.

[0066] Subsequent to the cleaning and drying processes, the chamber isreturned to the position shown in FIG. 8 by raising the upper plate 112under the action of the actuators 262. The substrate 616 remains chuckedto the upper plate 112 by the continuing flow of gas from the fluidsupply unit 103 to the upper primary channel 238 and the upper auxiliarychannels 241. The robot blade is then inserted into a position below thesubstrate 616. The substrate 616 is positioned on a blade by terminatingthe gas flow from the fluid supply unit 103. Once positioned on theblade, the substrate 616 is removed from the cleaning chamber 102 byretracting the blade through the slit valve door opening. The substrate616 may then be transferred to other chambers for additional processingor may be packaged for shipment in the case of a finished product.

[0067] In the foregoing operational description, the substrate 616 ischucked in a contactless manner, i.e., in a manner wherein substrate 616does not contact either the upper or lower portions of the chamber body,by flowing fluids from both the upper primary channel 238 and upperauxiliary channels 241, as well as lower primary channel 220 and lowerauxiliary channel 225. As a result of flow through the auxiliarychannels 241, some rotation may be imparted to the substrate 616.However, in another embodiment the primary and auxiliary channels 238,241 are individually valved. Accordingly, fluid flow though the channels238, 241 may be separately controlled. One such embodiment isillustrated in FIG. 11. In order to maintain isolated flow paths, a tube1102 is concentrically disposed in a coupler 1103 to connect the inletline 120 a to the upper primary channel 238. Another inlet line 1104connects the fluid supply unit 103 to the coupler 1103. A concentricpassageway defined between the coupler 1103 and the tube 1102 providesfluid communication between the fluid supply unit 103 and the upperauxiliary channels 241. Independently operable valves 1106, 1108 aredisposed in each of the inlet lines 120 a and 1104. In operation, afirst valve 1106 is opened to allow fluid flow from the fluid supplyunit 103 to the upper primary channel 238, thereby providing a pressureregion sufficient to chuck a substrate. Once the upper plate 112 islowered to seal the processing chamber 114, a second valve 1108 can beopened to allow fluid flow from the fluid supply unit 103 to the upperauxiliary channels 241 and cause the rotation of the substrate. Inanother embodiment, the lower primary channel 220 and lower auxiliarychannels 225 may be similarly valved.

[0068] In another embodiment, the manifold 213 may includecounter-oriented ports. FIG. 12 shows a manifold 1200 defining anopening 1201 (substantially defining the processing cavity 114). Themanifold 1200 has a first plurality of ports 1202 oriented in a firsttangential direction and a second plurality of ports 1204 oriented in asecond tangential direction. In one embodiment, the first plurality ofports 1202 provides an inlet for fluids into the processing cavity 114and the second plurality of ports 1204 provides an outlet/exhaust forfluids from the processing cavity 114. Such an arrangement is believedto allow for greater angular velocity of a substrate being processedthan can be achieved with the manifold 213. In another embodiment, boththe first and the second plurality of ports 1202, 1204 are adapted toflow fluids into the processing chamber 102. In such an arrangement,fluid flow from the first plurality of ports 1202 may cause rotation ofthe substrate during cleaning and fluid flow from the second pluralityof ports 1204 may halt the rotation at the end of the cleaning cycle. Inyet another embodiment, the ports may be valved to accommodate switchingbetween fluid flow into the processing region and exhausting fluid flowfrom the processing region. Thus, rotation of a substrate isaccomplished by simultaneously flowing fluid from the first plurality ofports 1202 and into the second plurality of ports 1204. At the end ofthe cleaning cycle, the substrate rotation is halted by reversing thefluid flow through the ports 1202, 1204 such that fluid is flowed intothe first plurality of ports 1202 and from the second plurality of ports1202.

[0069] The invention contemplates various recipes and methods to processa substrate in the cleaning chamber 102. Illustrative methods aredescribed with reference to FIG. 13. FIG. 13 shows a method 1300 whichprovides for a two-sided (i.e., upper and lower surfaces of a substratesimultaneously) clean/dry process and a one-sided (i.e., either theupper or the lower surfaces of a substrate) clean/dry process. Themethod 1300 begins at step 1302 where the substrate is loaded into theprocessing cavity 114 and the exhaust unit 105 is activated to evacuatethe processing cavity 114 via the ports 612 of the manifold 213. At step1304, one or more cleaning fluids are flowed from one of the modules 106a-d of the fluid supply unit 103 to the processing cavity 114. In a twosided cleaning process, cleaning fluid is flowed to the lower surface ofthe substrate 616 via the lower primary channel 220 and lower auxiliarychannels 225, at step 1306, thereby providing a pressure to the lowersurface of the substrate 616. At step 1308, cleaning fluid is flowedfrom the module 106 a-d to the upper primary and auxiliary channels 238,241 and then over the upper surface of the substrate 616. Preferably,steps 1306 and 1308 are preformed substantially simultaneously in orderto maintain the substrate at positional equilibrium and minimize thepotential for perturbations which could cause contact between thesubstrate and surrounding surfaces. Following step 1308, the substrate616 is substantially immersed in a bath of cleaning fluid. At step 1310,the substrate 616 is processed for a period of time in an environment ofcleaning fluids to clean both sides of a substrate.

[0070] At step 1312, the substrate is dried. In one embodiment, the flowof cleaning fluids is ceased and a drying agent is brought into contactwith the substrate 616. The drying agent may be provided from the dryingfluid module 104 of the fluid supply unit 103 while the substrate 616continues to rotate. The exhaust unit 105 continues to operate toexhaust the drying agent from the processing cavity 114. The transitionbetween flowing cleaning fluids and drying agents may be made bycontrolling a combination of the valves 126, 134 of the fluid supplyunit 103. In a two-sided cleaning process, the drying agent is allowedto contact all surfaces of the substrate by flowing the drying agentthrough the primary channels 220, 238 as well as through the auxiliarychannels 225, 241.

[0071] Step 1312 may further include terminating the flow of the dryingagent to the substrate and supplying a gas to the processing cavity 114.Accordingly, any residual fluid is flowed from the cavity 114 into theports 614 of the manifold 213. The drying of the substrate may befurther facilitated by evaporation of the fluids.

[0072] In one embodiment, a Marangoni drying process is used to dry thesubstrate. Marangoni drying is a process whereby surfacetension-reducing volatile organic compounds (VOC's) are passivelyintroduced (by natural evaporation and diffusion of vapors) in thevicinity of the meniscus of a thin film of liquid adhering to asubstrate in motion relative to the liquid. The introduction of theVOC's results in surface tension gradients which cause the liquid filmto flow off of the substrate, leaving it dry. In one embodiment, the VOCis an IPA/N₂ mixture.

[0073] For a one sided cleaning process, the method 1300 proceeds fromstep 1302 to step 1316, where a cleaning fluid is flowed on a first sideof a substrate. For example, an upper side of a substrate may be cleanedby flowing cleaning fluids through the upper primary channel 238 andupper auxiliary channels 241. At step 1318, a gas is flowed onto thesecond side of the substrate, i.e., the side not being cleaned. Thus,where the upper substrate surface is being cleaned, a gas is flowedthrough the auxiliary channels 225 and/or the lower primary channel 220.Flowing a gas onto the substrate surface not being cleaned provides agas barrier which acts to prevent the cleaning fluid from flowing ontothe surface while also providing an air cushion to prevent contactbetween the substrate and chamber components. Preferably, step 1318 isperformed simultaneously with step 1316 or slightly prior thereto. Atstep 1320, the substrate is processed for a period of time.

[0074] At step 1324 the substrate is dried. In a one-sided cleaningprocess, the drying agent is flowed onto the surface of the substratewhich has just been cleaned. A gas continues to be provided to the otherside of the substrate 616 in order to maintain the contactless conditionwithin the processing cavity 114. The method 1300 is exited at step 1314at which point the substrate may be removed from the cleaning chamber102.

[0075] In one embodiment, the cleaning process may include cleaning afirst side of the substance and subsequently cleaning the second side ofthe substrate. Thus, with reference to method 1300 of FIG. 13, steps1316, 1318, 1320 and 1324 may be repeated for each side of thesubstrate. Other embodiments contemplated by the invention will berecognized by those skilled in the art.

[0076] While the foregoing is directed to the preferred embodiment ofthe present invention, other and further embodiments of the inventionmay be devised without departing from basic scope thereof, and the scopethereof is determined by the claims that follow.

What is claimed is:
 1. A substrate cleaning chamber comprising: a) a chamber body having an upper surface and a lower surface cooperatively defining a processing cavity adapted to accommodate a substrate; b) a first fluid inlet formed in the chamber body terminating at the upper surface and being in fluid communication with the processing cavity; c) a second fluid inlet formed in the chamber body terminating at the lower surface and being in fluid communication with the processing cavity; and d) one or more evacuation ports disposed about the processing cavity at a radial distance from a center axis of the processing cavity.
 2. The apparatus of claim 1, wherein the one or more evacuation ports are oriented at an angle relative to a radial line originating at the center axis.
 3. The apparatus of claim 1, wherein the one or more evacuation ports are configured to provide a tangential flow of fluids away from the processing cavity.
 4. The apparatus of claim 1, wherein the one or more evacuation ports are radially disposed at a points substantially equal to the diameter of the processing cavity.
 5. The apparatus of claim 1, wherein the first fluid inlet and the second fluid inlet are disposed along the central axis.
 6. The apparatus of claim 1, wherein the chamber body further comprises an upper surface and a lower surface defining an upper boundary and a lower boundary of the processing cavity, respectively, wherein the first fluid inlet terminates proximate the center axis of the processing cavity on the upper surface.
 7. The apparatus of claim 1, further comprising a first plurality of propulsion channels formed in the chamber body and terminating at the upper surface, wherein at least a portion of the first plurality of propulsion channels are disposed at one of a clockwise and counterclockwise angle relative to the center axis.
 8. The apparatus of claim 1, further comprising a first plurality of propulsion channels formed in the chamber body and terminating at the upper surface, wherein at least a portion of the first plurality of propulsion channels are disposed at an angle relative to a radial line originating at the center axis.
 9. The apparatus of claim 8, wherein the first plurality of propulsion channels are configured to flow a fluid into the processing cavity at an angle relative to the radial line.
 10. The apparatus of claim 8, further comprising a fluid supply coupled to the first and second fluid inlets and to the first plurality of propulsion channels.
 11. The apparatus of claim 8, further comprising a second plurality of propulsion channels formed in the chamber body and terminating at the lower surface, wherein at least a portion of the second plurality of propulsion channels are disposed at an angle relative to a plane of the lower surface.
 12. The apparatus of claim 11, wherein the first plurality of propulsion channels and the second plurality of propulsion channels include outlet portions oriented in a common direction to provide an annular flow pattern in the processing cavity when a fluid is flowed through the outlet portions.
 13. The apparatus of claim 1, further comprising a gas supply and a liquid supply coupled to the first and second fluid inlets.
 14. The apparatus of claim 1, wherein the chamber body further comprises an upper plate having the upper surface disposed thereon and a lower plate having the lower surface disposed thereon, wherein the upper surface and lower surface are in substantial parallel relation.
 15. The apparatus of claim 14, further comprising an actuator coupled to at least one of the upper plate or lower plate to enable vertical motion of the plates.
 16. The apparatus of claim 1, further comprising a manifold disposed in the chamber body having the one or more evacuation ports formed therein.
 17. The apparatus of claim 16, wherein the manifold is coupled to the upper plate.
 18. The apparatus of claim 16, wherein recesses are formed in the manifold at a terminal end of the one or more evacuation ports.
 19. A substrate cleaning chamber comprising: a) a chamber body having an upper plate with an upper surface formed thereon and lower plate having a lower surface formed thereon, wherein the upper surface and the lower surface cooperatively define a processing cavity therebetween; b) a first fluid inlet formed in the chamber body and terminating at the upper surface; c) a second fluid inlet formed in the chamber body and terminating at the lower surface, wherein the first fluid inlet and the second fluid inlet are disposed along a center axis of the processing cavity; d) a first plurality of propulsion channels terminating on the upper surface at a radial distance from the center axis; e) a second plurality of propulsion channels terminating on the lower surface and at a radial distance from the center axis; and f) one or more evacuation ports disposed about the processing cavity at a radial distance from the center axis, wherein at least one of the first plurality of propulsion channels and the second plurality of propulsion channels are configured to impart rotational motion to a substrate positioned within the processing cavity.
 20. The apparatus of claim 19, further comprising an actuator coupled to at least one of the upper plate and the lower plate.
 21. The apparatus of claim 19, wherein the one or more evacuation ports are oriented at an angle relative to a radial line originating at the center axis.
 22. The apparatus of claim 19, wherein at least one of the one or more evacuation ports are oriented to provide a tangential flow of gas from the processing cavity.
 23. The apparatus of claim 19, wherein the first plurality of propulsion channels and the second plurality of propulsion channels include outlet portions oriented in a common direction to cooperatively provide an annular flow pattern in the processing cavity when a fluid is flowed through the respective outlet portions.
 24. The apparatus of claim 19, wherein at least a portion of first and second plurality of propulsion channels are disposed at one of a clockwise and counterclockwise angle relative to the center axis.
 25. The apparatus of claim 19, wherein the first and second plurality of propulsion channels are disposed to flow a fluid into the processing cavity at an angle to a radial line originating at the center axis.
 26. The apparatus of claim 25, further comprising a fluid supply coupled to the first and second fluid inlets and to the first plurality of propulsion channels.
 27. The apparatus of claim 19, further comprising a manifold disposed in the chamber body having the one or more gas evacuation ports formed therein.
 28. The apparatus of claim 27, wherein the manifold is coupled to the upper plate.
 29. The apparatus of claim 19, further comprising a fluid delivery system coupled to the first and second fluid inlets and to the first plurality of propulsion channels.
 30. The apparatus of claim 29, further comprising a vacuum unit coupled to the one or more evacuation ports.
 31. A processing system comprising: a) a transfer chamber; and b) at least one substrate cleaning chamber comprising: i) a chamber body defining a processing cavity adapted to accommodate a substrate and further defining an opening to accommodate transfer of a substrate from the transfer chamber into the processing cavity; ii) a first fluid inlet formed in the chamber body and in fluid communication with the processing cavity, the first fluid inlet being positioned about a center axis of the processing cavity; iii) a plurality of fluid propulsion channels terminating within the processing cavity, the plurality of fluid propulsion channels being configured to generate a fluid flow in an annular pattern; and iv) one or more gas ejection ports disposed about the processing cavity at a radial distance from the center axis of the processing cavity and oriented at an angle relative to a radial line originating at the center axis.
 32. The system of claim 31, further comprising a manifold disposed in the chamber body and having the one or more gas ejection ports formed therein.
 33. The system of claim 31, further comprising a gas supply coupled to the fluid inlet and a liquid supply coupled to the first fluid inlet.
 34. The system of claim 31, further comprising a robot disposed in the transfer chamber and adapted transfer substrates into the cleaning chamber.
 35. The system of claim 31, further comprising a liquid source coupled to the fluid inlet.
 36. The system of claim 31, wherein the one or more of the gas ejection ports are oriented to provide a tangential flow of gas from the processing cavity.
 37. The system of claim 31, wherein the plurality of propulsion channels further comprise a first plurality of fluid propulsion channels terminating at an upper surface of the processing cavity and a second plurality of fluid propulsion channels terminating at a lower surface of the processing cavity.
 38. The system of claim 37, wherein the plurality of first propulsion channels are disposed to flow a fluid into the processing cavity at an angle to a radial line originating at the center axis.
 39. The system of claim 37, further comprising a fluid supply in communication with the plurality of propulsion first channels.
 40. The system of claim 37, wherein at least a portion of the plurality of second propulsion channels are disposed at an angle relative to the radial line.
 41. The system of claim 40, wherein the first plurality of propulsion channels and the second plurality of propulsion channels include outlet portions oriented in a common direction to provide an annular flow pattern in the processing cavity when a fluid is flowed through the respective outlet portions.
 42. The system of claim 31, further comprising a manifold disposed in the chamber body and having the one or more gas ejection ports formed therein.
 43. The system of claim 42, wherein the manifold is an annular member coupled to an upper plate of the chamber body.
 44. The system of claim 31, wherein the chamber body comprises an upper plate and a lower plate in substantial parallel relation to each other and defining at least a portion of the processing cavity.
 45. The system of claim 44, wherein the first fluid inlet is disposed in the upper plate and a second fluid inlet is disposed in the lower plate.
 46. The system of claim 44, wherein the second fluid inlet are disposed along the center axis.
 47. A method for cleaning a substrate, comprising: a) providing a chamber body having a processing cavity therein that is at least partially defined by an upper surface and lower surface of the chamber body; b) positioning a substrate in the processing cavity; c) flowing a first fluid into the processing cavity and onto the substrate; and d) flowing a second fluid into the processing cavity onto the substrate an angle to cause rotation of the substrate about a center axis, wherein the flow of the first and second fluids is configured to maintain the substrate in the processing cavity in a contactless manner.
 48. The method of claim 47, further comprising maintaining the substrate in contactless environment in the cavity.
 49. The method of claim 47, wherein c) comprises flowing the first fluid from one or more channels formed in at least one of the upper and lower surface.
 50. The method of claim 47, wherein c) comprises flowing the first fluid from a first channel formed in the upper surface and a second channel formed in the lower surface, wherein the first and second channels are disposed along a center axis of the cavity.
 51. The method of claim 47, wherein c) comprises flowing the first fluid from a central portion of the substrate radially outward toward an edge of the substrate.
 52. The method of claim 47, wherein d) comprises flowing the second fluid at an angle to a radial line originating at a center of the substrate.
 53. The method of claim 47, wherein d) comprises providing a torque to the substrate.
 54. The method of claim 47, wherein c) comprises flowing the first fluid from a central portion of the substrate radially outward toward an edge of the substrate and wherein d) comprises flowing the second fluid at an angle to a radial line originating at a center of the substrate.
 55. The method of claim 47, wherein d) comprises flowing a fluid from ejection ports disposed about the perimeter of the substrate.
 56. The method of claim 47, wherein d) comprises flowing a fluid from outlets formed in one of the upper and lower surfaces.
 57. The method of claim 47, wherein b) comprises flowing the fluid into a space formed between an upper surface of the substrate and the upper surface.
 58. The method of claim 57, wherein flowing the fluid into the space comprises flowing the fluid from a channel formed in the upper surfaces.
 59. The method of claim 47, wherein b) comprises: positioning the substrate between the upper surface and the lower surface; and creating a low pressure in the space between the substrate and the upper surface to suspend the substrate.
 60. The method of claim 59, wherein b) further comprises actuating at least one of the upper and lower surfaces toward the other of the upper and lower surface.
 61. The method of claim 47, further comprising exhausting the first and second fluids from the cavity.
 62. The method of claim 61, wherein exhausting the first and second fluids comprises flowing the first and second fluids from the cavity into ports formed in the chamber body and disposed about the substrate. 